Universal Remote Control R7 - SPECS SHEET Instrukcja Użytkownika Pobierz pdf (Strona 42)

ADP5586 Data Sheet

Rev. 0 | Page 42 of 44

OUTLINE DIMENSIONS

01-20-2011-A

0.545

0.500

0.455

SIDE VIEW

0.230

0.200

0.170

0.300

0.260

0.220

COPLANARITY

0.05

SEATING

PLANE

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

BALL 1

IDENTIFIER

0.40

REF

1.20

REF

1.630

1.590 SQ

1.550

Figure 29. 16-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-16-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADP5586ACBZ-00-R7 −40°C to +85°C 16-Ball Wafer Level Chip Scale Package [WLCSP] CB-16-10

ADP5586ACBZ-01-R7 −40°C to +85°C 16-Ball Wafer Level Chip Scale Package [WLCSP] CB-16-10

ADP5586ACBZ-03-R7 −40°C to +85°C 16-Ball Wafer Level Chip Scale Package [WLCSP] CB-16-10

ADP5586CB-EVALZ WLCSP Evaluation Board CB-16-10

Z = RoHS Compliant Part.

1 2 ... 37 38 39 40 41 42 43 44

Data Sheet 1
TABLE OF CONTENTS 2
SPECIFICATIONS 3
ABSOLUTE MAXIMUM RATINGS 5
THEORY OF OPERATION 7
DEVICE ENABLE 8
DEVICE OVERVIEW 8
EVENT FIFO 9
KEY SCAN CONTROL 10
Data Sheet ADP5586 11
ADP5586 Data Sheet 12
GPI INPUT 13
GPO OUTPUT 13
LOGIC BLOCK 14
PULSE GENERATORS 16
REGISTER INTERFACE 17
REGISTER MAP 19
GPIO_INP_EN_B, Register 0x2A 33
RESET_EVENT_A, Register 0x2B 33
RESET_EVENT_B, Register 0x2C 33
RESET_EVENT_C, Register 0x2D 33
RESET_CFG, Register 0x2E 34
PIN_CONFIG_B, Register 0x3B 39
PIN_CONFIG_C, Register 0x3C 39
GENERAL_CFG, Register 0x3D 39
APPLICATIONS SCHEMATIC 41
ORDERING GUIDE 42

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